GLR Precision – Pioneer vibration control for sub-nanometer semiconductor manufacturing.
Passive damping falls short on low-frequency and shock-induced disturbances; GreLanor’s active isolation systems cut vibration transmission and suppress oscillation in real time, boosting yield and throughput.
Active platforms: SFN (compound spring), SFT (air), FSD (shock-resistant), miniPAD (integrated).
Trusted in semiconductor fabs and precision labs worldwide.
The FSD Series Active Vibration Isolation Platform integrates four vibration damping modules into one unit. Each module uses steel springs as the main support to achieve three-dimensional vibration isolation, and in conjunction with active vibration control in the vertical and horizontal directions, it realizes high-performance active vibration reduction with 6 degrees of freedom. A precision positioning control function is available as an option. This platform can meet the high-performance vibration reduction requirements of inspection equipment, metrology equipment, and packaging equipment.
Scenario: Packaging equipment of a leading domestic semiconductor manufacturer
Vibration transmissibility: As shown in the figure
Maximum moving mass:17kg
Motion acceleration:20m/s2
Position fluctuation during movement：<±70μm
Position fluctuation after movement stops：<±30μm
Settling time:100ms
Static jitter of the motion stage：2nm
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GLR Precision